STMicroelectronics · Grenoble, FR

At STMicroelectronics, we believe in the power of technology to drive innovation and make a positive impact on people, businesses, and society. As a global semiconductor company, our advanced technologies and chips form the hidden foundation of the world we live in today. When you join ST, you will be part of a global business with more than 115 nationalities, present in 40 countries, and comprising over 50,000 diverse and dedicated creators and makers of technology around the world. Developing technologies takes more than talent: it takes amazing people who understand collaboration and respect. People with passion and the desire to disrupt the status quo, drive innovation, and unlock their own potential. Embark on a journey with us, where you can innovate for a future that we want to make smarter and greener, in a responsible and sustainable way. Our technology starts with you. --- VOTRE RÔLE * Travailler en étroite collaboration avec les entreprises OSAT (Outsourcing & Assembly Test) situées à Taïwan. * Se familiariser avec le flux de processus WLCSP (Wafer Level Chip Scale Package). * Apprendre la procédure NPI (New Product Introduction) de STMicroelectronics au sein des usines d’assemblage Backend. * Collaborer étroitement avec les équipes R&D Backend afin d’évaluer les TGA (Technical Gap Analysis - Analyse des écarts techniques) et les FMEA (Failure Mode and Effects Analysis - Analyse des modes de défaillance et de leurs effets) des nouveaux produits. * Mettre en œuvre et suivre l’avancement des essais réalisés chez les OSAT. VOS COMPÉTENCES ET EXPÉRIENCES * Diplôme de niveau Licence ou Master en chimie, physique ou ingénierie. * Bonne maîtrise de l’anglais, à l’oral comme à l’écrit. * Esprit de collaboration et capacité à travailler en équipe. * Esprit d’initiative. ST is proud to be one of the 17 companies certified as a 2025 Global Top Employer and the first and only semiconductor company to achieve this distinction. ST was recognized in this ranking thanks to its continuous improvement approach and stands out particularly in the areas of ethics & integrity, purpose & values, organization & change, business strategy, and performance. At ST, we endeavor to foster a diverse and inclusive workplace, and we do not tolerate discrimination. We aim to recruit and retain a diverse workforce that reflects the societies around us. We strive for equity in career development, career opportunities, and equal remuneration. We encourage candidates who may not meet every single requirement to apply, as we appreciate diverse perspectives and provide opportunities for growth and learning. Diversity, equity, and inclusion (DEI) is woven into our company culture. To discover more, visit st.com/careers.

STMicroelectronics · Hsinchu, TW

OUR STORY At STMicroelectronics, we believe in the power of technology to drive innovation and make a positive impact on people, businesses, and society. As a global semiconductor company, our advanced technologies and chips form the hidden foundation of the world we live in today. When you join ST, you will be part of a global business with more than 115 nationalities, present in 40 countries, and comprising over 50,000 diverse and dedicated creators and makers of technology around the world. Developing technologies takes more than talent: it takes amazing people who understand collaboration and respect. People with passion and the desire to disrupt the status quo, drive innovation, and unlock their own potential. Embark on a journey with us, where you can innovate for a future that we want to make smarter and greener, in a responsible and sustainable way. Our technology starts with you. YOUR ROLE As a key driver of our Back-end Technology Expansion in Taiwan, you will spearhead the industrialization of ST's advanced back-end technology bricks for Analog products, with a core focus on WLCSP (Wafer Level Chip Scale Packaging). This is a highly visible, cross-functional role where you will transform cutting-edge engineering concepts into scalable mass production. You will act as the strategic technical bridge between ST and our external partners, leveraging your data-driven expertise to ensure operational excellence and flawless execution. Key Responsibilities: * Technology Industrialization: Lead and manage the transfer and industrialization of WLCSP and back-end technology bricks with third-party partners/OSATs in Taiwan. * Cross-Company Collaboration: Serve as the primary technical interface, utilizing strong negotiation and persuasion skills to align external partners with ST’s rigorous quality and yield standards. * Data-Driven Optimization: Apply a sharp analytical mindset to evaluate production data, identify technical bottlenecks, and drive continuous yield improvement. YOUR SKILLS & EXPERIENCES We are looking for a high-potential professional who combines technical agility with strong business acumen. * Education: Master’s degree in a STEM field (Science, Technology, Engineering, or Mathematics). * Professional Experience: Minimum of 2 years of hands-on experience within a manufacturing environment (Semiconductor front-end or back-end/OSAT experience is highly preferred). * Technical & Analytical Competence: A strong generalist technology background with an analytical mindset. Proven capability in data analysis to derive actionable insights from complex datasets. * Soft Skills & Influence: Exceptional communication skills with the ability to influence, convince, and navigate technical negotiations with external vendors. * Language Proficiency: Business proficiency in English (both written and spoken) is required for seamless global and cross-site collaboration. ST is proud to be one of the 17 companies certified as a 2025 Global Top Employer and the first and only semiconductor company to achieve this distinction. ST was recognized in this ranking thanks to its continuous improvement approach and stands out particularly in the areas of ethics & integrity, purpose & values, organization & change, business strategy, and performance. At ST, we endeavor to foster a diverse and inclusive workplace, and we do not tolerate discrimination. We aim to recruit and retain a diverse workforce that reflects the societies around us. We strive for equity in career development, career opportunities, and equal remuneration. We encourage candidates who may not meet every single requirement to apply, as we appreciate diverse perspectives and provide opportunities for growth and learning. Diversity, equity, and inclusion (DEI) is woven into our company culture. To discover more, visit st.com/careers.

STMicroelectronics · Hsinchu, TW

OUR STORY At ST, we believe in the power of technology to drive innovation and make a positive impact on people, business, and society. We are a global semiconductor company, and our advanced technology & chips forms the hidden part of the world we live in today. When you join ST, you will be part of a global business of more than 115+ nationalities and present in 40 countries, 50,000+, diverse and dedicated creators & makers of technology around the world! Developing technologies takes more than talent: it takes amazing people who understands collaboration and respect. People with passion and desire to disrupt the status quo, push boundaries and drive innovation – whilst unlocking your own potential. YOUR ROLE * Primary interface between ST Divisions and subcontractor (OSAT) to ensure timely respond on technical events & enquiry from all GOBM stakeholders (external customer, Division / Groups, ST BEMT plants, internal support organization and OSAT). * Responsible to drive assembly, yield improvement of OSAT to meet GOBM KPI target. * Support customer on-site audit and driving technical resolution in OSATs; especially at assembly area. * Accountable to drive subcontractor for continuous improvement on technical KPI and initiatives such as PCN, QUAL pass, successful evaluations, LG BKMU+ deployment etc. * Training subcontractor on ST’s technical requirement & tools. * Interface between OSAT and Division on product / package development / NPI, supporting technical review and production ramp up. YOUR SKILLS & EXPERIENCES * Bachelor’s degree in, Engineering or related field (or equivalent experience). * Proven experience in product WLCSP, with a strong understanding of Bumping, DPS etc methodologies and processes. * Knowledge of WLCS methodologies, process flow and problem solving. * Excellent communication and collaboration skills to work effectively in a team environment. * English business proficiency. Working at ST means innovating for a future that we want to make smarter, greener, in a responsible and sustainable way. Our technology starts with you. Join us and start the future! To discover more, visit st.com/careers