STMicroelectronics · CN

OUR STORY At ST, we believe in the power of technology to drive innovation and make a positive impact on people, business, and society. We are a global semiconductor company, and our advanced technology & chips forms the hidden part of the world we live in today. When you join ST, you will be part of a global business of more than 115+ nationalities and present in 40 countries, 50,000+, diverse and dedicated creators & makers of technology around the world! Developing technologies takes more than talent: it takes amazing people who understands collaboration and respect. People with passion and desire to disrupt the status quo, push boundaries and drive innovation – whilst unlocking your own potential. YOUR ROLE This position will closely cooperate with OSAT, Division and R&D team, mainly focusing on new product development and smooth production \- Deploy technical requirements on new subcontractors \- Define critical process characteristics with subcons to fit product characteristics defined by internal customers \- Yield improvement and process improvement projects \- Involve in package maturity (NPI) \- Involve in automotive readiness project \- Develop workable system and template (when there is no ST format) \- Deploy ST technical projects (Inkless Map, STIF, ULT) \- Manage change management \- Package roadmap benchmarking YOUR SKILLS & EXPERIENCES * Bachelor's degree or above * > 8 years relevant experience in Semiconductor * Proficient in Semiconductor assembly processes * Experienced in APQP, SPC, FMEA, DOE, 8D, SPC, etc * Good problem solving, statistical analyst and project management skills * Able to manage complex technical problems independently * Good communication skills in both verbal and written English * Experienced in MS software Working at ST means innovating for a future that we want to make smarter, greener, in a responsible and sustainable way. Our technology starts with you. Join us and start the future! To discover more, visit st.com/careers

STMicroelectronics · CN

OUR STORY At ST, we believe in the power of technology to drive innovation and make a positive impact on people, business, and society. We are a global semiconductor company, and our advanced technology & chips forms the hidden part of the world we live in today. When you join ST, you will be part of a global business of more than 115+ nationalities and present in 40 countries, 50,000+, diverse and dedicated creators & makers of technology around the world! Developing technologies takes more than talent: it takes amazing people who understands collaboration and respect. People with passion and desire to disrupt the status quo, push boundaries and drive innovation – whilst unlocking your own potential. YOUR ROLE This position will closely cooperate with OSAT, Division and R&D team, mainly focusing on new product development and smooth production \- Deploy technical requirements on new subcontractors \- Define critical process characteristics with subcons to fit product characteristics defined by internal customers \- Yield improvement and process improvement projects \- Involve in package maturity (NPI) \- Involve in automotive readiness project \- Develop workable system and template (when there is no ST format) \- Deploy ST technical projects (Inkless Map, STIF, ULT) \- Manage change management \- Package roadmap benchmarking YOUR SKILLS & EXPERIENCES * Bachelor's degree or above * > 8 years relevant experience in Semiconductor * Proficient in Semiconductor assembly processes * Experienced in APQP, SPC, FMEA, DOE, 8D, SPC, etc * Good problem solving, statistical analyst and project management skills * Able to manage complex technical problems independently * Good communication skills in both verbal and written English * Experienced in MS software Working at ST means innovating for a future that we want to make smarter, greener, in a responsible and sustainable way. Our technology starts with you. Join us and start the future! To discover more, visit st.com/careers